Ramping up the Power – 300mm PVD for Metallization of Silicon IGBTs and other Power Semiconductor Devices
Mar 07, 2019This webinar discusses how physical vapor deposition (PVD) can be used to deposit both thick frontside metal, and thinner multi-layer backside metals deposited after wafer thinning. The presentation will give details of how our Sigma? PVD technology overcomes various challenges which can affect yields in power device manufacturing, including eliminating whiskers during thick metal deposition, avoiding contamination from organics, active-face protection and stress control of backside layers on thinned wafers.
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