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Advanced Packaging Webinar Series (Part I) – Low Temperature Dielectric Deposition for Advanced Packaging

Aug 05, 2021

In this webinar we demonstrate how high quality PECVD dielectric films can be deposited at temperatures as low as 100°C while maintaining high film quality and stability. We then discuss the use of these films in a number of advanced packaging applications.

SPTSCVDDepositionWebinar

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