Product Description
The Filmetrics Profilm3D and Filmetrics Profilm3D-200 white light interferometers generate high-resolution measurements of the surface topography with sub-nanometer-level resolution. The tools support both vertical scanning and phase shifting interferometry. Phase Shift Imaging (PSI) can also be combined with WLI to enable PSI sensitivity over larger surface Z variation. Using TotalFocus? technology, Profilm3D provides stunning 3D natural color images with every pixel in focus. The latest generation of the Profilm3D white light interferometer introduces Enhanced Roughness imaging for measuring rougher surfaces, higher slopes and lower reflectivity surfaces.
In the Profilm3D measurement technique, the vertical resolution of the measurement is independent of the numerical aperture of the objective, enabling high-resolution measurements with a large field of view. The measured area can be further increased by stitching multiple fields of view into a single measurement. The Profilm3D optical profilometer also features a simple, innovative user interface and automated features to support a broad range of working environments, from R&D to production.
Features
- Vertical scanning and phase shifting interferometry for measurement of surface features from nanometers to millimeters
- TotalFocus 3D imaging with optimized focus for each pixel through the full measured range
- True-Color imaging produces the actual sample colors for enhanced visualization, especially for subtle or buried features
- Enhanced Roughness Mode (ERM) increases fringe contrast for improved fidelity on sloped surfaces such as lenses and enables signal improvement for rough surfaces
- Automated focus with industry-leading long piezo travel range for scanning multiple surfaces separated by large height distances
- Automated X-Y stage with a long travel range, great for mapping and stitching scans
Applications
- Step height: 3D step height from nanometers to millimeters
- Texture & Form: 3D roughness, waviness, bow and shape
- Texture characterization
- Edge rolloff: 3D edge profile measurements
- Defect review: 3D defect surface topography, defect characterization
- High resolution scans over large, transparent film surfaces
- High roughness, low reflectivity, scratch characterization
Industries
- Universities, research labs and institutes
- Silicon and compound semiconductor
- Precision optics and mechanics
- Medical devices
- LED: Light emitting diodes
- Power devices
- MEMS: Micro-electromechanical systems
- Data storage
- Automotive
- And more: Contact us with your requirements
