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Our engineers are faced with the toughest problems every day as they develop and integrate the technologies at the core of our differentiated products. For a team of engineers and scientists in our metrology division, the toughest problem they faced involved work on our Axion^??? T2000 X-ray metrology system. This team harnessed the power of X-rays, refined AI-based algorithms and developed patented technologies to produce a fab-ready system that measures high-aspect ratio memory device features with unprecedented resolution, accuracy, precision and speed. The resulting Axion T2000 discovers the small 3D shape anomalies that can impact advanced 3D NAND and DRAM performance, helping ensure successful production of memory chips.